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Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)Soldering paste
 Tools and equipmentAll for mobile phone repairFlux, paste, balls for repairing mobile phones
Product code:
030002

Solder paste Sn42Bi58 JF-800905 PbFree 25 g, with bismuth, low melting point

Low-melting lead-free soldering paste with NC type flux, designed for soldering LED SMD elements. For production and repair. Sn42Bi58 alloy. LOW melting point .
Solder paste Sn42Bi58 JF-800905 PbFree 25 g, with bismuth, low melting point
211,70 UAH × = 211,70 UAH
from 1 pc : 211,70 UAH
from 5 pcs : 207,50 UAH ( -2,0%)
from 20 pcs : 203,20 UAH ( -4,0%)

Current balances: 18 pcs


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Solder paste is a mixture of solder powder and gelatinous flux.
When heated, the powder is fused in a flux environment, forming a brazed joint.
No Clean class flux gel paste, does not require cleaning.
Recommended for renovation work and small batch production.

Low-temperature solder paste is optimal for soldering LEDs, as well as for assembling double-sided PCBs when soldering the second side of the board (the first is soldered to a higher-temperature paste).

Characteristics:
 
The chemical composition of the solder alloy in percent:
  • Sn (tin) - 42%
  • Bi (bismuth) - 58%
Temperature range:
  • preheat: 90-110°C
  • reflow start: 138°C
  • soldering temperature: 150°C
  • storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for stencil application to the board.
 
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures from+5°C to+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.

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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.

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