Code | Photo | Name | Remains | Price | Cart | ||
---|---|---|---|---|---|---|---|
016599 | Heat-conducting adhesive -12% Thermally conductive adhesive for bonding heat sinks to electronic components. One-component. | всього: 60 pcs |
| ||||
017692 | Flux gel -12% Medium activity rosin-based flux for soldering with tin-lead and lead-free solders. Jar 100 ml. | всього: 5 pcs маг ДП: 1 pc |
|