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Eco-friendly tin (Sn) and copper (Cu) based solder wire, lead free. It is used in electronics and electrical engineering for the production of electronic devices and components and for soldering electronic components on printed circuit boards for surface and through mounting. The Sn99Cu1 alloy is produced in accordance with the PN EN 29453: 2000 standard by casting without air access and subsequent extrusion, which excludes the formation of oxide.
Copper content: 1% Tin content: 99% Melting point: eutectic 240°C Working temperature: 300°C to 380°C Density: 7.30 g/cm3 Flux Sw32: Halogenated rosin based modified with organic activators. non-corrosive flux for electronics applications and electrical engineering. Residues do not require cleaning. Flux content: 2.0%
Manufacturer: CYNEL
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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![Solder LC- Sn99Cu1 [0.7mm, 100g] RMA 2.5% flux](/files/pic/pripou/sn99c-07-01-s.jpg)
![Solder LC- Sn99Cu1 [0.7mm, 100g] RMA 2.5% flux](/files/pic/pripou/sn99c-07-01.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
