Platform for infrared heating of printed circuit boards from below when dismantling (assembling) electronic components.
Unlike hot air preheaters, in which heat is transferred by convection (hot air), this design uses direct heating - i.e. transfer of thermal energy from a heating element by a stream of infrared radiation of a long-wave sub-band.
Advantages of IR heating of printed circuit boards over heating with air flow:
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lack of influence of turbulence of the air flow, and, as a result, uniformity of heating;
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a much larger area of the heated area;
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the possibility of limiting the heating of individual sections of the board by shielding with reflective foil;
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no noise and vibration from the blower.
Adjustable skids are provided for mounting the boards. The maximum width of the board installed in the holder is 245mm.
The size of the heating zone is 245mm * 255mm.
The length of the slide is 320 mm, but the board may protrude slightly from the slide.
If there is not enough width, you can lay the board directly on top of the sled.
To prevent the large board from bending, an additional sliding central support is provided.
The heating element is ceramic, of two segments.
Temperature controller with digital display and push-button control.
Characteristics:
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supply voltage - 220V, 50Hz
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maximum power consumption - 1.6 kW
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heating zone dimensions - 260mm x 242mm
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temperature adjustment range of the platform heating element - 0°С to 450°С
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overall dimensions - 410х316х117mm
Together with a hot air soldering station, the infrared preheater is quite affordable and quality equipment for repairing mobile phones, PDAs, digital cameras, computer boards, etc., and can also be successfully used for prototyping, in the development and manufacture of small batches of products.
Warranty obligations for all models of soldering stations and board heaters are 3 months.
The warranty does not cover heating elements and soldering tips, which are consumables.