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Solder paste P825-0307-89 J5 Qualitek P825 SAC0307 type 4, 89% metal [500 g]
Lead-free medium melting solder paste with no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Sn/Ag/Cu alloy. Bank of 500 grams.
NOT available.
Expected price:2 035,00UAH
from 1 pc :
—
2 035,00
UAH
from 3 pcs :
—
1 994,00
UAH
( -2,0%)
from 10 pcs :
—
1 953,00
UAH
( -4,0%)
Prices are indicated at the time of product availability and may change upon receipt
825HF is a lead-free, no-clean, halogen-free solder paste formulated specifically for a wide range of lead-free alloys.
The paste provides a high level of fluxing with excellent wetting of copper OSP coatings. Wide technological windows of the reflow process in combination with high heat resistance allow obtaining solder joints with smooth surfaces.
In doing so, 825HF Paste provides repeatable and consistent print performance combined with long application and peel times to facilitate high-speed printing. This material has excellent printing properties on boards of various designs and when using very fine pitch.
Benefits:
Excellent wetting and adhesion for pads down to 0.25 micron with 4000 inch stencil
Halogen-free
Low void formation
Excellent resistance to hot sludge
Increased time spent on the stencil
Long retention time
Non-cracking residues of medium softness
Suitable for work in air or nitrogen environment
Complies with RoHS Directive 2002/95/EC
Alloy - Sn/Ag/Cu
Particle size: 20-38 microns
Metal content of the paste: 89%
Solder composition
Qualitek Sn/Ag/Cu (Tin/Silver/Copper) alloys are developed as a lead-free alternative to Sn/Pb alloys for soldering electronic assemblies. Qualitek Sn/Ag/Cu alloys meet and exceed J-STD-006B contamination requirements as well as all other relevant international standards.
Physical/chemical properties
Color/Appearance - Metallic Gray
Copper Mirror Test (for flux corrosivity) - Passes without violations
Silver chromate test - Passes without discoloration
Recommended reflow profile of solder paste:
Preheat zone The preheat zone is used to raise the board temperature to the desired wetting temperature. In the preheating zone, the board temperature is constantly increasing at a rate of no more than 2.6°C/s. The preheating zone of the oven should occupy 25 - 33% of the total heated tunnel length.
The wetted zone usually occupies 35 - 50% of the total length of the heated tunnel; heats the board to a relatively stable temperature so that components of different masses become the same temperature. The wet zone will also allow the flux to concentrate and the volatiles to evaporate from the paste.
The reflow zone raises the board temperature from the activation temperature to the recommended peak temperature. The activation temperature is always slightly below the melting point of the solder, while the peak temperature is always above the melting point.
Flux residues and cleaning
DSP 825HF is a no-clean agent; therefore, residues do not need to be removed in normal use. The residues of the flux after reflow are light. If residues need to be removed, use Everkleen 1005 buffered saponifier at a concentration of 5 - 15% at 60°C (140°F).
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.