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Foiled aluminum is used in the manufacture of printed circuit boards for components with high heat generation, i.e. when the printed circuit board itself is a heatsink.
First of all, these are LED flashlight boards. The use of medium and high power LEDs without such heat sink boards is practically impossible.
Also, the use of boards on an aluminum substrate is justified in power supplies, in automotive electronics - wherever intense thermal operating conditions are expected.
The material is a three-layer “pie”: an aluminum base is covered with a layer of heat-conducting dielectric - a ceramic composition. Before application, aluminum is oxidized; the oxidation thickness is at least 10 microns. Copper foil is laminated over the dielectric layer.
Material properties:
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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Алюминий PCB
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
