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Used to improve heat transfer between heat-generating elements of electronic circuits (processors, power transistors, diodes, LED-crystals, processors, video chips) and a heatsink.
Plastic, after pressing, it gradually fills all microroughnesses, providing good thermal conductivity.
It is a dielectric. No additional measures are required to electrically isolate the component from the radiator, no need to install a mica gasket, etc.
Size: 50 x 50 mm
Thickness: 0.5mm
Specifications:
color: gray-blue
thermal conductivity coefficient, not less: 3.2 W/(m·K)
operating temperature range: -60°C to +180°C
density: 2.28 ±0.2 g/cm³
hardness: (Shore): 20 ±5
elongation: 130% ±13%
tensile strength: 8 ±2 kg * f/cm²
dielectric strength:> 1.5 kV/mm
wave impedance:> 10 17 Ohm * meter
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