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Whole catalog Materials for production and repairHeat transfer materialsHeat-conducting substrates
Product code:
038573

Thermal pad PM150 [1 mm, 100x100mm] for 2SORT processor

Electrically insulating and thermally conductive silicone backing, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 1 mm, sheet 100 x 100 mm. Grade 2
Thermal pad  PM150 [1 mm, 100x100mm] for 2SORT processor
Expected price: 50,40 UAH
from 1 pc : 50,40 UAH
from 4 pcs : 47,88 UAH ( -5,0%)
from 10 pcs : 45,36 UAH ( -10,0%)
Prices are indicated at the time of product availability and may change upon receipt

Current balances:

NOT available

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Attention, discounted product!
The reason for the markdown is small sheet defects along the edge, no more than 10 mm deep into the sheet.



Used to ensure good heat transfer between the heat-generating component (processor, micro-assembly, LED ) and a radiator.
Also has dielectric properties, electrically isolating the heat sink from the component.
The silicone base gives the material high elasticity, the backing fills the microrelief of the mating surfaces well.
Aluminum nitride, which has excellent thermal conductivity, is used as a filler.
Specifications:
  • thickness: 1 mm
  • sheet size: 100 x 100 mm
  • thermal conductivity: 1.5W/mK
  • dielectric constant: 4.5 kV/mm
  • operating temperature range: -50°C+200°C
  • linear elongation ratio: 1.48



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