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Heat transfer tape without adhesive AGThermopad 20x130x1mm, 1.5 W/mK art.AGT-134
Heat-conductive silicone backing. For mounting heatsinks on heat-producing electronic components. Thickness 1 mm, strip 20 x 130 mm. Producer: AG TermoPasty, Poland.
AG TermoPasty art.AGT-134 Thermal conductive tape without glue AGThermopad 20x130x1mm, 1.5 W/mK
Thermal conductive tapes are used where it is inconvenient to use thermal conductive paste.
The material is characterized by high compressibility, which ensures good thermal contact between the mating surfaces of parts requiring cooling.
The backing is a very viscous mass sandwiched between two protective sheets of glossy paper.
The silicone base of the composition gives the material high elasticity, the substrate well fills the microrelief of the mating surfaces.
Without an adhesive layer, during installation it is necessary to ensure mechanical fixation and pressing of the elements.
Application:
Fills micro-irregularities between contacting elements to ensure heat transfer.
thermal conductivity coefficient at temperatures 0-150°C, (W/m)*K: >1.5
Attention! Before installation, carefully remove the protective paper. When removing the paper, slight delamination of the material may occur; some of the composition may remain on the protective paper. This is not a defect; when the mating surfaces are compressed, the mass of the thermal substrate is deformed and uniformly fills the microrelief.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
