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Whole catalog Materials for production and repairHeat transfer materialsHeat-conducting substrates
Product code:
044140

Heat transfer tape without adhesive AGThermopad 20x130x2mm, 1.5 W/mK art.AGT-135

Heat-conductive silicone backing. For mounting heatsinks on heat-producing electronic components. Thickness 2 mm, strip 20 x 130 mm. Producer: AG TermoPasty, Poland.
Heat transfer tape without adhesive AGThermopad 20x130x2mm, 1.5 W/mK art.AGT-135
Manufacturer: AG TermoPasty (AGT)
In stock
128,60 UAH × = 128,60 UAH
from 1 pc : 128,60 UAH
from 4 pcs : 125,90 UAH ( -2,1%)
from 10 pcs : 123,40 UAH ( -4,0%)

Current balances:

Магазин-Днепр
5 pcs
For Online Orders
5 pcs

Technical documentation

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Product Description:
 
AG TermoPasty art.AGT-135 Thermal conductive tape without glue AGThermopad 20x130x2mm, 1.5 W/mK

Thermal conductive tapes are used where it is inconvenient to use thermal conductive paste.
The material is characterized by high compressibility, which ensures good thermal contact between the mating surfaces of parts requiring cooling.
The backing is a very viscous mass sandwiched between two protective sheets of glossy paper.
The silicone base of the composition gives the material high elasticity, the substrate well fills the microrelief of the mating surfaces.
Without an adhesive layer, during installation it is necessary to ensure mechanical fixation and pressing of the elements.
 
Application:
 
Fills micro-irregularities between contacting elements to ensure heat transfer.
 
Application:
  • installation of temperature sensors
  • installation of semiconductor device radiators
Manufacturer : AG TermoPasty


Characteristics:
  • thickness: 2 mm
  • size: 20 x 130 mm
  • thermal conductivity coefficient at temperatures 0-150°C, (W/m)*K: >1.5
Attention! Before installation, carefully remove the protective paper. When removing the paper, slight delamination of the material may occur; some of the composition may remain on the protective paper. This is not a defect; when the mating surfaces are compressed, the mass of the thermal substrate is deformed and uniformly fills the microrelief.

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