Low reactive rosin based flux gel (RO class).
Does not require cleaning of residues after soldering (except for high voltage and microwave units).
Recommended for mounting elements in BGA, PGA, PLCC, QFP, CSP packages.
For soldering with medium-melting lead-containing solders, as well as low-melting lead-free alloys.
High viscosity flux, little spreads over the board when heated.
Has increased temperature stability during the soldering process.
Suitable for all types of soldering: soldering iron, hot air, infrared heat radiation.
It has proven itself well in repair applications: repair of mobile phones, computer motherboards and other devices with a high density of SMD components.
The manufacturer cares about the reputation of its products. Each syringe cartridge is provided with an individual serial number.
The authenticity of the product can be verified by entering the serial number on the page
manufacturer's website.
Characteristics:
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flux consistency: gel
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viscosity: 2550
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color: matt white
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packing: cup
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volume: 100 ml
Файл с описанием
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
