Recommended for repairing mobile phones, tablets, laptops.
Excellent fluidity in a hot state, due to the capillary effect, it penetrates well into the gaps between the pins of the components and the pads of the board.
Evaporates completely without leaving conductive residues.
The difference of this model of fluxes from similar ones is the reduced smokiness during soldering.
Weakly active synthetic based flux gel (RE class).
Does not require cleaning of residues after soldering (except for high voltage and microwave units).
Recommended for mounting elements in BGA, PGA, PLCC, QFP, CSP packages.
For soldering with medium-melting lead-containing solders, as well as low-melting lead-free alloys.
Has increased temperature stability during the soldering process.
It is especially suitable for non-contact soldering: hot air, infrared heat radiation. Working with a soldering iron is somewhat difficult due to the high evaporation rate of the flux.
It has proven itself well in repair applications: repair of mobile phones, computer motherboards and other devices with a high density of SMD components.
The manufacturer cares about the reputation of its products. Each syringe cartridge is provided with an individual serial number. The authenticity of the product can be verified by entering the serial number on the page
manufacturer's website.
Characteristics:
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flux consistency: gel
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viscosity: 90 (Pa * S)
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grain size: 30 microns
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working temperature: 220-240°C
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color: matt white
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packing: syringe cartridge
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volume: 10 ml
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
