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Thermally conductive insulating backing made of silicone rubber, reinforced with fiberglass cloth and polyimide fiber.
Has a high coefficient of thermal conductivity.
Placed between heat sinks and housings of high-power semiconductor elements, processors or Peltier modules as electrical insulation and to improve heat dissipation.
Characteristics:
thermal conductivity coefficient: 1.0 W/m * K
breakdown voltage: 3.5-4.5 kV
operating temperature range: from - 60°C to+200°C
thickness: 0.45 ±0.02mm
color: pink/gray/blue
Attention! Installation of substrates does not require the use of heat-conducting pastes. The maximum thermal conductivity is established several hours after installation, when the plastic substrate material fills the microrelief of the surfaces of the electronic component and the heat sink.
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