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Whole catalog Materials for production and repairHeat transfer materialsHeat-conducting substrates
Код товара:
032222

Thermal pad PM150 [2 mm, 100x100mm] for processor

Electrically insulating and heat-conducting silicone substrate, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 2 mm, sheet 100 x 100 mm.
Thermal pad PM150 [2 mm, 100x100mm] for processor
Expected price: 92,00 UAH
from 1 pc : 92,00 UAH
from 4 pcs : 87,40 UAH ( -5,0%)
from 10 pcs : 82,80 UAH ( -10,0%)
Prices are indicated at the time of product availability and may change upon receipt

Current balances:

NOT available

Изображение товара

Product description format_size zoom_out zoom_in

It is used to ensure good heat transfer between the heat-generating component (processor, micro-assembly, LED) and the heatsink.
Also has dielectric properties, electrically isolating the heat sink from the component.
The silicone base gives the material high elasticity, the backing fills well the microrelief of the mating surfaces.
Aluminum nitride, which has excellent thermal conductivity, is used as a filler.
 
Characteristics:
  • thickness: 2mm
  • sheet size: 100 x 100 mm
  • thermal conductivity: 1.5W/mK
  • dielectric constant: 4.5 kV/mm
  • operating temperature range: -50°C+200°C
  • linear elongation ratio: 1.48



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