It is used to improve heat transfer between the heat-generating elements of electronic circuits (processors, power transistors, diodes) and the radiator, as well as between the thermal sensor and the heat-generating element. It is a heat-resistant white mass of high viscosity.
It is not a dielectric, so if you want to electrically isolate the component from the radiator, you must install a mica gasket.
It is obtained by thickening the polydimethylsiloxane liquid with zinc oxide powder. Factory packing - 4 kg cans.
Specifications:
- White.
- Explosion-proof, non-flammable, chemically inert, does not have an irritating or toxic effect on humans.
- Corrosive effect: no greenery on the copper plate for 24 hours.
- Working temperature range: from -60 to +180°C
- Density: 2.6-3.0 g/cm3
- Specific volumetric electrical resistance: not less than 1012 Ohm cm
- Breakdown voltage for a layer of 1 mm and a frequency of 50 Hz: not less than 2 MV/m.
- Relative dielectric constant (no more):
50 Hz - 6.0;
1 MHz - 4.0;
10 MHz - 4.8.
- Penetration: 150.
- Electric strength: 2.0-5.0 kV/mm.
- The tangent of the angle of dielectric losses at a frequency of 10 MHz: no more than 0.005.
- Dynamic viscosity at 20°C: 130-180 Pa·s.
- Radiation resistance: permissible integral dose of radiation - 1.25 x 100 million Rad.
Thermal conductivity coefficient, W/(m K), not less:
-50 °C — 1,0;
20 °C — 0,7;
100 °C — 0,65.
![Heat-conducting paste KPT-8 [100 g]](/files/pic/pasta/010841-s.jpg)
![Heat-conducting paste KPT-8 [100 g]](/files/pic/pasta/010841.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
