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Foil-clad aluminum is used in the manufacture of printed circuit boards for components with high heat dissipation, i.e. when the PCB itself is a heatsink.
First of all, these are boards for LED lights. The use of medium and high power LEDs without such heat sinking boards is practically impossible.
Also, the use of boards on an aluminum substrate is justified in power supplies, in automotive electronics - wherever an intense thermal operation is expected.
The material is a three-layer "cake": the aluminum base is covered with a layer of dielectric - fiberglass. Aluminum is oxidized before application, the oxidation thickness is at least 10 microns. Copper foil is laminated along the dielectric layer.
Material properties:
Test project
Processing conditions
unit
Typical values
LJ01
LJ02
LJ03
Thermal
A
?/W
1.8-2.0
0.35-0.4
0.35-0.4
Peel Strength
After thermal
stress
N/mm
1.85
1.7
1.7
Surface Resistivity
C-96/35/90
MΩ
7×109
5×109
5×108
3×109
2×109
4×108
Dielectric Breakdown
A
KV
>2.0
2.0
2.0
1MHZ Dielectric constant At
Arc resistance into abnormal condition
1MHZ
3.8
3.9
2.7
1MHZ Dielectric dissipation
-
0?028
0?026
0?009
Flammability
-
V-0
V-0
V-0
Arc resistance
S
250
250
250
CTI
-
225
225
225
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
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![Aluminum foil LJ01 t.2,0mm 70/00 (300x100) [No. 112] one-sided](/files/pic/steklotekstolit/011210-s.jpg)
![Aluminum foil LJ01 t.2,0mm 70/00 (300x100) [No. 112] one-sided](/files/pic/steklotekstolit/011210-b.jpg)
![Aluminum foil LJ01 t.2,0mm 70/00 (300x100) [No. 112] one-sided](/files/pic/steklotekstolit/022555.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
