JF8770 is a new environmentally friendly water based product.
It has excellent ability to remove all types of solder paste residue, flux residue, oil stains, fingerprints, metal oxides.
Thanks to ultrasonic cleaning,
it can be used for high precision cleaning of high precision, high density, high frequency components such as microBGA and Flip-Chips.
The product is developed by our company's patented technology, with strong cleaning power, odorless and halogen free.
The soft formula has good compatibility with various materials, especially copper and aluminium.
The product is ready to use, dilution is not required.
Recommended washing temperature +25~40°C.
Packing 1 liter (packaged from the factory canister 20 liters).
A detailed description of the properties is given in the "Documentation" tab on this page. Please download the file and take a look.
JF-8770_TDS
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
