Solder paste Sn62Pb36Ag2 JF-800906 Syringe 25 g, with silver, medium melting Купить в интернет-магазине

Solder paste Sn62Pb36Ag2 JF-800906 Syringe 25 g, with silver, medium melting

Medium melting tin-lead solder paste with flux type ROL1. Designed for reflow soldering of SMD elements. For production and repair. Contains silver.

271,50 UAH

from 1 pc :	—	271,50	UAH
from 5 pcs :	—	263,40	UAH	( -3,0%)
from 20 pcs :	—	255,20	UAH	( -6,0%)

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Solder paste is a mixture of solder powder and gel flux.

When heated, the powder fuses in the flux, forming a solder joint.

Flux-gel class ROL1, most suitable for repair work and small-scale production.

Medium-temperature solder paste is optimal for critical soldering of SMD elements with a pitch of 0.3 mm.
Has very good wettability.
It is also used for assembling double-sided printed circuit boards when soldering the first side of the board (the second is soldered using low-temperature paste).

Characteristics:

Chemical composition of solder alloy in percentage:

Sn (tin) - 62%
Pb (lead) - 36%
Ag (silver) - 2%

Temperature:

preheating: 90-150°C
start of reflow: 178°C
soldering temperature: 190°C - 210°C
storage temperature: +5°C to +15°C

The viscosity of the paste is optimal for application to the board through a stencil.

Packaging: medical syringe 5 ml (weight 25 grams).

Storage conditions: at temperatures between +5°C and +15°C, try to avoid direct sunlight.

Shelf life: 6-8 months, then the properties of the paste deteriorate.

Attention! Do not use the paste directly from the syringe! The paste must be mixed thoroughly before use. When storing the paste, the solder powder settles. This cannot be done with a syringe. You need to transfer the paste into some container. In this case, the medical syringe is a transport package that guarantees no contact with air.

Suggested replacements

Solder paste JF-800906 [with silver, 500g]

Product code: 011097

3 682,00 UAH

NOT available

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