Solder paste is a mixture of solder powder and gelatinous flux.
When heated, the powder is fused in a flux environment, forming a brazed joint.
The NC class flux gel in the paste provides a small amount of flux residues after soldering, which in many cases avoids the washing process.
Sn64Bi35Ag1 medium temperature lead-free solder paste is made of 64% tin, 35% bismuth and 1% silver alloy.
Silver in the amount of 1% is added to active bismuth, providing good wettability during reflow and elasticity of the brazed joints.
This composition allows the use of the paste for devices operating at low temperatures.
The paste is optimal for soldering LED boards, LED light drivers, computer boards, as well as mobile phones.
Suitable for all kinds of high-precision boards.
Characteristics:
The chemical composition of the solder alloy in percent:
-
Sn (tin) - 64%
-
Bi (bismuth) - 35%
-
Ag (silver) - 1%
Temperature range:
-
preheat: 110-160°C
-
reflow start: 189°C
-
soldering temperature: 210°C
-
storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for stencil application to the board.
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures from+5°C to+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
Recommended thermal profile:
|
Heating rate |
time to reach 110°C |
constant temperature 110-138°C |
Maximum temperature |
210±10°C |
cooling rate
|
|
1-3°C/sec |
<60-90 sec |
60-100 sec |
175±5°C |
30-60 sec |
<4°C/sec |
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
