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Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)Soldering paste
 Tools and equipmentAll for mobile phone repairFlux, paste, balls for repairing mobile phones
Код товара:
031546

Solder paste Sn64Bi35Ag1 JF-800904 PbFree 25g, with silver, medium melting

Medium melting NC-type lead-free solder paste. Designed for reflow soldering of SMD elements. For production and repair. Contains silver and bismuth.
Solder paste Sn64Bi35Ag1 JF-800904 PbFree 25g, with silver, medium melting
180,00 UAH × = 180,00 UAH
from 1 pc : 180,00 UAH
from 5 pcs : 174,60 UAH ( -3,0%)
from 20 pcs : 169,20 UAH ( -6,0%)

Current balances:

Магазин-Днепр
19 pcs
For Online Orders
19 pcs

Изображение товара

Product description format_size zoom_out zoom_in

Solder paste is a mixture of solder powder and gelatinous flux.
When heated, the powder is fused in a flux environment, forming a brazed joint.
The NC class flux gel in the paste provides a small amount of flux residues after soldering, which in many cases avoids the washing process.

Sn64Bi35Ag1 medium temperature lead-free solder paste is made of 64% tin, 35% bismuth and 1% silver alloy.
Silver in the amount of 1% is added to active bismuth, providing good wettability during reflow and elasticity of the brazed joints.
This composition allows the use of the paste for devices operating at low temperatures.
 
The paste is optimal for soldering LED boards, LED light drivers, computer boards, as well as mobile phones.
Suitable for all kinds of high-precision boards.
 
Characteristics:
 
The chemical composition of the solder alloy in percent:
  • Sn (tin) - 64%
  • Bi (bismuth) - 35%
  • Ag (silver) - 1%
Temperature range:
  • preheat: 110-160°C
  • reflow start: 189°C
  • soldering temperature: 210°C
  • storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for stencil application to the board.
 
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures from+5°C to+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
Recommended thermal profile:

Heating rate time to reach 110°C constant temperature 110-138°C Maximum temperature 210±10°C cooling rate
 
1-3°C/sec <60-90 sec 60-100 sec 175±5°C 30-60 sec <4°C/sec

 


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