Recommended for soldering microcircuits in BGA cases when repairing mobile phones, tablets, laptops.
Excellent fluidity in a hot state, due to the capillary effect, it penetrates well into the gaps between the pins of the components and the pads of the board.
It evaporates well, the remaining flux is negligible, it is easy to wash off.
Weakly active flux-gel class ROL1 (weakly active, rosin-based).
Recommended for mounting elements in BGA, PGA, PLCC, QFP, CSP packages.
For soldering with medium-melting lead-containing solders, as well as low-melting lead-free alloys.
Has increased temperature stability during the soldering process, ensures the absence of solder balls, icicles.
It is especially suitable for non-contact soldering: hot air, infrared heat radiation. Working with a soldering iron is somewhat difficult due to the high evaporation rate of the flux.
It has proven itself well in repair applications: repairing mobile phones, computer motherboards and other devices with a high density of SMD components.
Specifications:
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product name: JUFENG JF15304
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flux consistency: gel
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working temperature: 220-240°C
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color: matt white
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packing: medical syringe
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volume: 2 ml
Классификация флюсов
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
