Base - steel plate, nickel plated. Massive, 3 mm thick.
Coated with a heat-resistant carbon composite overlay.
The thickness of the pad is 3 mm, the sockets for the BGA chips are molded in it.
The pad not only withstands high temperatures, but also has a low thermal conductivity. Thermal pad minimizes heat transfer to the substrate. This isolation of the heat transfer makes it easier to warm up the chips in the sockets.
The weight of the device is over 400 grams, no additional attachment to the table is required.
The retainer guides are made of one-piece metal square bar.
On the longitudinal guide, the stop is spring-loaded and equipped with a locking screw.
The stops have slots for fixing the board. The thickness of the groove is 1.2 mm, but if necessary, it will be easy to increase the grooves. The stops are made of aluminum.
On the surface of the base, there are indentations for working with BGA chips:
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NANO - 17.2 x 12.2 mm
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A11 - 15.1 x 14.35mm
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A9 - 15.0 x 14.8mm
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A8- 14.5 x 13.8 mm
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CBA - 9.3 x 9.3 mm
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PCIE - 14.95 x 12.05 mm
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A10 - 15.95 x 14.75mm
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BGA - 10.2 x 8.0 mm
Specifications:
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base size: 130 x 90 mm
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base material: steel+composite
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base thickness: 3 mm
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minimum board width: 50 mm (along the longitudinal guide)
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maximum board width: 80 mm (along the longitudinal guide)
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maximum board thickness: 1.2 mm
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weight: 410 mm
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
