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Solder paste Sn62.8Pb36.8Ag0.4 JF-406800904NC syringe 25 g, medium melting with silver
Medium melting tin-lead solder paste with low-residue no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Contains silver.
Sn62.8Pb36.8Ag0.4 No-Clean Solder Paste is a tin-lead solder paste composed of 62.8% tin, 36.8% lead, and 0.4% silver.
No-clean solder paste is designed for surface mounting (SMT). Contains a special flux, spherical tin powder and a small amount of oxide components. Optimum solder paste viscosity ensures high quality continuous printing. The flux used contains a low ionic halogen activator. After reflow, it has significantly less residues, high insulating surface strength, stable and optimal electrical performance.
Specifications:
Solder alloy chemical composition in percent:
Sn (tin) - 62.8%
Pb (lead) - 36.8%
Ag (silver) - 0.4%
Temperature range:
preheat: 90-150°C
reflow start: 178°C
soldering temperature: 190°C - 210°C
storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for applying to the board through a stencil.
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures between+5°C and+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
