Solder paste is a mixture of solder powder and gel-like flux.
When heated, the powder is fused in a flux environment, forming a brazed joint.
RMA grade flux gel, most suitable for refurbishment and small batch production.
Medium temperature solder paste is optimal for soldering SMD elements.
The eutectic composition of the alloy provides good flowability of the solder, uniform fillet gloss.
It is also used for assembling double-sided printed circuit boards when soldering the first side of the board (the second is soldered to low-temperature paste).
Characteristics:
The chemical composition of the solder alloy in percent:
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Sn (tin) - 63%
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Pb (lead) - 37%
Temperature range:
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preheat: 90-150°C
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reflow start: 183°C
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soldering temperature: 190°C - 210°C
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storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for stencil application to the board.
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures from+5°C to+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
