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It is used to improve heat transfer when installing processors, semiconductors, high-power LEDs.
Possesses high fluidity, well fills the microrelief of surfaces.
Does not dry out, does not corrode surfaces.
Packaging: 100 gram tube.
Characteristics:
name
K-5211H
appearance
white paste
penetration( 1/10mm, 25°C)
260 ~ 300
density (g/cm3)
2,0 ~ 2,3
shrinkage (%. 200°C, 8 h)
≤2.0
volatility (%. 200°C, 8 h)
≤2.0
breakdown voltage ( kV/mm)
≥10
volumetricresistance(Ohm. Cm)
4 × 10 14
tthermal conductivity (W/m * K)
≥ 1,2
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